Welded bellows for semiconductor chip processing equipment
Product parameter
| Specification | 7nm | 14nm |
|---|---|---|
| Application equipment | BPM Bellows | |
| Material | HC276 | |
| Outside diameter | 185 | |
| Inside diameter | 150 | |
| Service life | million times | |
| Use environment | Inside vacuum/outside atmosphere | |
| Operating temperature | 300℃ | |
